semiconductor chip

semiconductor chip

美 　英

• un.半導體芯片器件；半導體片狀器件
• 網絡半導體晶片；半導體基片

英漢解釋

un.	1. 半導體芯片器件 2. 半導體片狀器件

例句

At least a semiconductor chip (such as a microphone chip) is arranged on the base part and right over the shield plate.

至少一個半導體芯片（例如麥克風芯片）安裝在基座部上并且在屏蔽板的正上方。

The invention discloses a semiconductor structure including ad aisy chain adjacent to an edge of a semiconductor chip.

本發明公開一種半導體結構，包括與半導體芯片的邊緣相鄰的串狀鏈。

intel is a semiconductor chip maker , developing integrated technology platforms for computing and communications.

英特爾是一家半導體芯片制造商，主要開發面向計算和通信領域的集成技術平臺。

A means for fabrication of solenoidal inductors integrated in a semiconductor chip is provided.

本發明提供一種用于制造被集成于半導體芯片中的螺線管電感器的手段。

and second reflector formed on circuit board surface at the semiconductor chip side and reflecting preset test light.

和第二反射器，形成于在電路板側上的半導體芯片的表面上并反射預定的測試光。

Long triangle area is the core of industry of Chinese semiconductor chip, assemble is numerous international lead firm.

長三角地域是中國半導體芯片工業的核心，集聚眾多國際超前廠商。

PROMOTING "THE FUNDAMENTAL RESEARCH OF INTEGRATED SYSTEM ON-A-SEMICONDUCTOR-CHIP"

大力支持“半導體集成化芯片系統的基礎研究”

In this thesis, we will design planar antenna and semiconductor chip antenna, of the wireless communication.

在本論文中，我們將設計平板天線與半導體晶片天線，以便應用在無線通訊的機構中。

Although industry of Chinese semiconductor chip develops rapid, but crop takes the whole world only 6% the left and right sides.

中國半導體芯片工業雖成長敏捷，但產量僅占寰球的6%擺布。

Method and baths for electroless depositing Cu on a semiconductor chip using four preferred Cu electroless baths.

方法和化學沉積浴場，半導體芯片上使用四個優先銅銅電解池。

Side surfaces and the second main surface of the semiconductor chip made thin are sealed with resin.

以及用樹脂密封被減薄的所述半導體芯片的側表面和所述第二主表面。

But it is too slowly to the inspection of the semiconductor chip on line and other applications because of the single point scanning.

但象對半導體在線檢測等應用領域，單點掃描方法測量速度慢，限制了其應用。

Semiconductor Chip trading company, such as Memory IC, Flash Memory. . . etc.

半導體晶片的買賣業，如記憶晶片，快閃記憶體等。

A semiconductor integrated circuit device comprising: a semiconductor chip having a plurality of surface electrodes;

本發明提供一種半導體集成電路器件，其包括：半導體芯片，具有多個表面電極；

second resin material installed sealed to the semiconductor chip on top of the circuit board;

第二樹脂材料，密封安裝到電路板上方的半導體芯片；

first reflector formed on the circuit board surface on the semiconductor chip side and reflecting preset test light;

第一反射器，形成于半導體芯片側上的電路板的表面上并反射預定的測試光；

first resin material filled in the gap between circuit board and semiconductor chip;

第一樹脂材料，填充到電路板和半導體芯片之間的間隙中；

Attracting semiconductor chip manufacturers to set up fabrication plants in Hong Kong

吸引半導體晶片制造商在香港設立制造廠事宜